Advancing PCB and Assembly Testing at NPL

Advancing PCB and Assembly Testing at NPL: Update on capabilities and what they can tell us

The National Physical Laboratory (NPL) continues to lead innovation in test methods for printed circuit boards and electronic assemblies, supporting manufacturers and end-users across the electronics industry. In this webinar, Martin Wickham from NPL’s Electrical and Electronics Reliability Team will present recent advancements in testing capabilities, including:

• Enhanced condensation testing for evaluating moisture-related failure mechanisms and conformal coating performance.
• Expanded surface insulation resistance (SIR) measurement systems for high-sensitivity reliability assessments.
• Newly developed high-voltage AC testing for dielectric materials, enabling simulation of partial discharge and long-term degradation.

These developments are helping NPL’s partners improve product reliability and performance in demanding environments. Join us to explore how these cutting-edge methods are shaping the future of electronics testing.