Following on from last years Silicon to Systems event, NMI have this year partnered with IMEC and DSP Valley to bring you the latest in how to develop low cost Application Specific Integrated Circuits (ASICs) for almost any application.
Many people are put off designing ASICs because they think it’s too hard, too expensive or they don’t have the skills. This conference aims to show you that an ASIC could be easier and less costly than you think. It will show there are a range of strategies that can be used to successfully implement an ASIC solution even in low to moderate volumes.
According to Phillip Christie of the Business Technology & Strategy Group at IMEC, “The continued falling cost of ASIC manufacturing is a message that really needs to get out. This message is especially important for start-ups and SMEs focussing on IoT markets, where more mature technologies have a strong role play. I think the conference on Easy Access ASICs will be a tremendous networking opportunity and an excellent way to gain access to the low-cost manufacturing infra-structure that is now in place.”
Patrick McNamee from the NMI continued “It seems that in semiconductors all the news in the last year or so has been about mergers and acquisitions. However our members are telling us that there is a real and growing demand from SME’s to enable them to get into ASIC for a whole range applications including IOT, medical and automotive sectors this conference should demonstrate several ways this can be achieved at low cost.”
Who Should Attend?
Mangers and senior managers who are interested in developing an ASIC for a new application or maybe looking at a cost reduction path from existing PCB or FPGA solutions.
09:00 Welcome & Introduction – NMI & DSPvalley
Keynote 1: Low-Cost Pathways to Volume Production for CMOS ASICs and Photonic ICs
– Phillip Christie, IMEC
Keynote 2: Selecting the Right Technology Node for Your New Design
– Paul de Bot, TSMC
Session 2 : Design Tools and I/P Choices
– Mentor Graphics
“The Way to Securely Design a Low-Power SoC Demonstrated on Silicon”
– Lucille Engels, Dolphin Integration
“So You Think Developing a SoC Needs to be Complex or Expensive? Think Again”
– Philip Burr, ARM
Session 3: Package, Test and Turnkey Choices
“Packaging Selection, Rise of the System in Package (SiP)”
– Nicole Tien, ASE Europe
“Test and Test Development”
– Cedric Mayor, Presto Engineering
“Re-Thinking the Semiconductor Supply Chain for IoT”
– John Tinson, Sondrel
Session 4: Real World Case Studies
“Case Study 1”
– Andy Maund, EnSilica
“Every MEMS Needs its ASIC”
– Jeroen Van Ham, ICsense
“Case Study 3”
– Joan Ceuterick, AnSem
16:00 EVENT CLOSE